Hoku Materials enters into agreement with Dynamic Engineering
Hoku Materials, Inc., a subsidiary of Hoku Scientific, Inc. (Nasdaq: HOKU), a seller of polysilicon to the solar market, and Dynamic Engineering, Inc., a process technology and engineering firm, said this morning that they have entered into an Engineering Services & Technology Transfer Agreement.
Under the agreement, Dynamic Engineering will provide design and engineering services, and a technology license to allow Hoku Materials to build a trichlorosilane production and purification unit at its polysilicon production plant in Pocatello, Idaho.
Trichlorosilane, or TCS, is produced through the chlorination and purification of metallurgical-grade silicon and is the primary material used to produce polysilicon in a Siemens reactor.
Shares of Hoku Scientific (HOKU) jumped 21.38%, or $1.93, to $10.98 in pre-market trading. Shares of Hoku Scientific have traded in the range of $2.52 to $14.55 for the past 52 weeks.
